All designs from drawing board to working prototype require three experiments before delivery
1. Where the fuck is daylight, we tried to follow the specs
2. Triage, escape with only critical bugs fixed
3. Overreach - we could make this work like the spec and close those last few bugs.
Then, as experiment #3 rolls off the line we become unusually fond of our one night stand in triage. Proper use of the 80/20 rule emerges from panic and anguish. Just get us hardware boot and get rid of the hot spots across the surface. And for god sake make some improvements on ESD protection.
The last thing we fix are continuously available resources or 'logical' hotspots. It's always hotspots. The reason it is always hot spots that must not intrude is that the die is designed to utmost precision to evenly diffuse current flow and hence.
Every problem in geometry and engineering can be solved with three data points. Bet on the solution from the second data point.
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